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    Photoelectric / Laser Device Shell Series

    Photoelectric / laser device type housing

    Performance characteristics:

    This product is used in optical communication, microwave packaging, industrial laser, power electronics and other fields.

    product details

    General performance:

    Air tightness: ≤1×10-3Pa·cm3/s

    Lead insulation resistance: ≥1×109Ω

    Implementation standards:

    The indicators meet the requirements of GJB2440-2006 "General Specification for Hybrid Integrated Circuit Enclosures".

    * Can be customized according to different specifications of customers.

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